SCALING
In
scaling there are really two issues
• Devices
Can we build smaller devices
·
What will their performance be try to avoid the wet
noodle effect Wires
·
There is concern about our ability to scale both of
these Components
1. Limitations
Limitations
to device scaling has been around since working in 3m nMOS, 22 years ago
(actually bipolar)
• Worries
were
§ Short
channel effect
§ Punchthrough
• drain
control of current rather than gate
§ Hot
electrons
§ Parasitic
resistances
• Now
worries are a little different
§ Oxide
tunnel currents
§ Punchthrough
§ Parameter
control
§ Parasitic
resistances
2. Transistor scaling
People
are building very short channel devices
§ Shown are
I-V curves for 15nm L pMOS
§ And a
short channel nMOS
§ The
structure is strange
§ FinFET
But you
can make them work
3. Wire scaling
More
uncertainty than transistor scaling
§ Many
options with complex trade-offs
• For each
metal layer
§ Need to
set H, TT, TB, e1, e2, conductivity of the metal
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